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Scanner Maintenance and Calibration 8
Agilent 5500 SPM User’s Guide 142
movement) and a single tube for Z motion. Since the range is small with
these scanners, the effect of cross-coupling is minimal.
Aging
Aging is a time-dependent effect in which the sensitivity (extension per
unit of field) of the scanner decreases, approximately exponentially,
over time. A large amount of decrease takes place during the first few
hours of use. Therefore, scanners are burned in before initial calibration.
After this initial burn-in, the aging rate is very slow; however,
calibration once or twice per year is still recommended.
Creep
At a constant applied voltage the piezo position will change slightly
over time, most noticeably at the beginning of a scan or after a change
on scan location. Creep appears as elongation of the feature in the
direction of the offset because of this slow movement (Figure 93).
Figure 93 Scanner creep
- Agilent Technologies 1
- 5500 Scanning Probe 1
- Microscope 1
- Specifications 4
- Laser Safety Information 4
- Power Supply 5
- Piezo Scanner Precautions 6
- General Care Requirements 6
- Disclaimers 6
- Declaration of Conformity 8
- Contact Information 9
- Table of Co ntents 10
- Read This First 10
- 2 Agilent 5500 SPM Components 10
- 4 Preparing for Imaging 11
- 5 Contact Mode Imaging 12
- 6AC Modes 12
- 7 Additional Imaging Modes 12
- 9 Closed-Loop Scanners 13
- 10 MAC Mode 14
- 11 MAC III Mode 14
- 12 Liquid Cell 14
- 13 Temperature Control 14
- 14 Environmental Control 15
- 15 Electrochemistry 15
- A Wiring Diagrams 15
- Index 15
- SPM Basics 18
- SPM Techniques 20
- Atomic Force Microscopy (AFM) 21
- Contact Mode AFM 23
- Intermittent Contact AFM 24
- Acoustic AC (AAC) AFM 25
- Current Sensing Mode (CSAFM) 27
- Agilent 5500 SPM Components 32
- Figure 10 33
- Agilent 5500 SPM Components 2 35
- Mode/Contact Mode imaging 37
- Detector 40
- Sample Plates 41
- Video System 43
- Head Electronics Box (HEB) 44
- AFM Controller 45
- Vibration Isolation Chamber 46
- Software 47
- System Options 48
- Thermal K 50
- Environmental Chamber 50
- PicoTREC 51
- PicoLITH 52
- Facility Requirements 55
- Utilities 56
- Connecting the Components 58
- Preparing for Imaging 59
- One-Piece Nose Assembly 60
- Preparing for Imaging 4 61
- Two-Piece Nose Assembly 67
- Aligning the Laser 72
- Figure 52 Laser alignment 77
- Mounting the Sample 83
- Using the Video System 86
- Contact Mode Imaging 92
- Constant Force Mode 93
- Constant Height Mode 100
- Fine-Tuning the Image 100
- Scan Settings 101
- Contact Mode Imaging 5 102
- AC Modes 103
- Acoustic AC Mode (AAC) 104
- AC Modes 6 106
- and/or Y Offset values to 108
- Magnetic AC (MAC) Mode 110
- Standard MAC Mode 111
- Q Control 112
- Additional Imaging Modes 114
- 1 G 100 M 115
- Current Sensing AFM (CSAFM) 119
- Additional Imaging Modes 7 123
- Kelvin Force Microscopy (KFM) 134
- Agilent Technologies 137
- Nose Assembly 138
- Scanner Characteristics 139
- Non-Linearity 140
- Sensitivity 140
- Hysteresis 140
- Figure 92 141
- Other Characteristics 141
- Figure 93) 142
- X Calibration 144
- X Non-Linearity 145
- X Hysteresis 146
- Y Calibration 147
- Y Non-Linearity 148
- Y Hysteresis 149
- Y Sensitivity 150
- Z Calibration 151
- Servo Gain Multiplier 152
- Archive the Calibration Files 152
- Closed-Loop Scanners 153
- Calibration 154
- set to 0.000 156
- Z Sensor Calibration 158
- Closed-Loop Scanners 9 160
- MAC Mode 162
- Connections 163
- Hardware and Sample Setup 164
- MAC Mode 10 165
- MAC III Mode 166
- Initial Setup 167
- MAC III Mode 11 169
- MAC III Software Controls 171
- Contact Mode 172
- Lock-In Tabs 183
- Outputs Tab 185
- Other Tab 188
- Liquid Cell 190
- Liquid Cell 12 191
- Liquid Cell with MAC Mode 193
- Flow-Through Liquid Cell 193
- Temperature Control 194
- Temperature Control 13 195
- Do not use double-sided tape 200
- Water Cooling 206
- Environmental Control 209
- Environmental Control 14 211
- Glove Box 212
- Electrochemistry 213
- Modes or STM Mode 214
- Electrochemistry 15 215
- Equipment 216
- Reference Electrode 217
- Counter Electrode 217
- Cleaning 218
- Electrode Cleaning 219
- Sample Plate Cleaning 219
- Substrate Cleaning 219
- Electrochemistry Definitions 220
- Software Controls 221
- Galvanostat 222
- Wiring Diagrams 223
- Appendix A 223
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