Agilent Technologies MXG (Series A and B) Wartungshandbuch

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Inhaltsverzeichnis

Seite 1 - Generators

Agilent TechnologiesSecurity Features and Document of VolatilityAgilent Signal GeneratorsThis manual provides documentation for the following instrume

Seite 2 - Safety Notices

10 Products Covered by this DocumentDocument PurposeDocument PurposeThis document describes instrument memory types and security features. It provides

Seite 3 - Warranty

11Products Covered by this DocumentRecommended Software UpgradesRecommended Software UpgradesThe information in this section applies only to PSG and E

Seite 4

12 Products Covered by this DocumentRecommended Software Upgrades

Seite 5 - 1 Table of Contents

13Security Terms and Definitions4Security Terms and DefinitionsTerm DefinitionClearing As defined in Section 8-301a of DoD 5220.22-M, “National Indust

Seite 6 - Contents

14 Security Terms and Definitions

Seite 7 - Service Offices

15Instrument Memory & Volatility5 Instrument Memory & VolatilityThis chapter contains information on the memory components in your instrument.

Seite 8

16 Instrument Memory & VolatilityMXG (Series B) & EXG MemoryMXG (Series B) & EXG MemoryThe following tables describe each memory type used

Seite 9 - Document

17Instrument Memory & VolatilityMXG (Series B) & EXG Memory4. Front Panel Memory(SRAM)2KByteYes No Front panel operating memoryFront panel fir

Seite 10 - Document Purpose

18 Instrument Memory & VolatilityMXG (Series B) & EXG Memory2. Extended Persistent Memory(Flash SSD)40 GByte, partitioned as follows:4 GByte:

Seite 11 - Recommended Software Upgrades

19Instrument Memory & VolatilityMXG (Series A) MemoryMXG (Series A) MemoryThe following tables describe each memory type used in the base instrume

Seite 12

Notices© Agilent Technologies, Inc. 2004-2014No part of this manual may be reproduced in any form or by any means (including electronic storage and re

Seite 13 - Definitions

20 Instrument Memory & VolatilityMXG (Series A) Memory3. Firmware Memory(Flash)8MByteNo Yes Main firmware image Factory installed or firmware upgr

Seite 14

21Instrument Memory & VolatilityMXG (Series A) Memory5. Calibration Data(Flash)256 KByteNo Yes Factory calibration and configuration data backupFa

Seite 15 - Volatility

22 Instrument Memory & VolatilityMXG (Series A) Memory2. Extended Persistent Memory(Flash)a4GByteYes Yes All user data Normal user operationUser d

Seite 16

23Instrument Memory & VolatilityESG and PSG MemoryESG and PSG MemoryThe following tables describe each memory type used in the base instrument, op

Seite 17

24 Instrument Memory & VolatilityESG and PSG Memory3. Firmware Memory (Flash)12 MByteNo Yes Main firmware image Factory installed or firmware upgr

Seite 18

25Instrument Memory & VolatilityESG and PSG Memory6. Calibration Backup Memory (Flash)512 KByteNo Yes Factory calibration/ configuration data back

Seite 19 - MXG (Series A) Memory

26 Instrument Memory & VolatilityESG and PSG Memory2. BBG Firmware Memory (Flash)32 MByteNo Yes Firmware image for baseband generatorFirmware upgr

Seite 20

27Instrument Memory & VolatilityESG and PSG MemoryTable 5-7 Hard Disk (E4438C/E8267C/E8267D with Option 005)Memory Component, Type and SizeWritab

Seite 21 -  320 MByte

28 Instrument Memory & VolatilityESG and PSG MemoryTable 5-8 Flash Drive (E8257N with Options 008 and 340, E8257D/E8663D with Option 008, and E82

Seite 22

29Memory Clearing, Sanitization and Removal Procedures6 Memory Clearing, Sanitization and Removal ProceduresThis chapter describes several security fu

Seite 23 - ESG and PSG Memory

3WarrantyThis Agilent technologies instrument product is warranted against defects in material and workmanship for a period of one year from the date

Seite 24

30 Memory Clearing, Sanitization and Removal ProceduresErase AllErase AllThis function removes all user files, user flatness calibrations, user I/Q ca

Seite 25

31Memory Clearing, Sanitization and Removal ProceduresErase and Overwrite AllErase and Overwrite AllThis function is available in MXG Series A, PSG, a

Seite 26

32 Memory Clearing, Sanitization and Removal ProceduresErase and Sanitize AllErase and Sanitize AllThis function performs the same actions as Erase Al

Seite 27

33Memory Clearing, Sanitization and Removal ProceduresForce Internal to SD CardNOTE The Erase and Sanitize All operation resets the instrument’s LAN s

Seite 28

34 Memory Clearing, Sanitization and Removal ProceduresClear Persistent State InformationClear Persistent State InformationPersistent StateThe persist

Seite 29 - Procedures

35Using Secure Mode7Using Secure ModeNOTE The "Secure Mode" procedure described here is available only for MXG Series A, PSG (except E8257N

Seite 30 - Erase All

36 Using Secure Mode3 Activate Secure Mode CAUTION Once you activate secure mode (by pressing Confirm), you cannot deactivate or decrease the Security

Seite 31 - Erase and Overwrite All

37Using Secure Display8 Using Secure DisplayNOTE Front panel control of this feature is not available on PSG E8257N instruments (unless Option 340 is

Seite 32 - Erase and Sanitize All

38 Using Secure Display

Seite 33 - Force Internal to SD Card

39Security Issues for Certain Firmware RevisionsFirmware Update Procedure9 Security Issues for Certain Firmware RevisionsThe information in this chapt

Seite 35 - 7Using Secure Mode

40 Security Issues for Certain Firmware RevisionsError Messages and Secure EnvironmentsError Messages and Secure EnvironmentsIf you cannot upgrade the

Seite 36

41Security Issues for Certain Firmware RevisionsRecovering Erased System FilesRecovering Erased System FilesTo recover the lost files, perform the fol

Seite 37 - 8 Using Secure Display

42 Security Issues for Certain Firmware RevisionsRecovering Erased System Files

Seite 38 - Using Secure Display

43Procedure for Declassifying a Faulty Instrument10 Procedure for Declassifying a Faulty InstrumentIf the instrument is not functional, and you are un

Seite 39 - Firmware Revisions

44 Procedure for Declassifying a Faulty InstrumentOnce the Processor and Hard Disk assemblies have been removed, proceed as in Table 10-2 below:Table

Seite 40

45Procedure for Declassifying a Faulty InstrumentSolid State (Flash) Drive(E8257N Option 008, E8257D/E8663D Option 008, and E8267D Option 009 only)Rem

Seite 41

46 Procedure for Declassifying a Faulty Instrument

Seite 42

47ReferencesA: References1. DoD 5220.22-M, “National Industrial Security Program Operating Manual (NISPOM)”United States Department of Defense. Revise

Seite 43 - Faulty Instrument

This information is subject to change without notice.© Agilent Technologies, Inc. 2004-2014Published in USA, February 2014Supersedes: August 2012E4400

Seite 44

Contents 51 Table of Contents2. Contacting Agilent Sales and Service Offices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Seite 45

6 Contents

Seite 46

7Contacting Agilent Sales and Service Offices2 Contacting Agilent Sales and Service OfficesAssistance with test and measurement needs, and information

Seite 47 - A: References

8 Contacting Agilent Sales and Service Offices

Seite 48 - Agilent Technologies

9Products Covered by this Document3 Products Covered by this DocumentProduct Family Name Product Name Model Number Firmware RevisionX-Series Signal Ge

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