2
The DDR3 BGA Probe Advantage
Features Benefits
Connects directly to the DDR3 BGA balls. Eliminates reflections from mid-bus probing methods. Also
eliminates board space and trace routing required for connector
probing methods.
Supports:
Get complete signal access to the DDR3 signals critical to your
debug and validation effort.
• Single die x4, x8 and x16 configuration
• Stacked/dual-die x4, x8 and x16 configuration
• Stacked/quad-die x4, x8 and x16 configuration
• Operating transfer rate of 1333 Mb/s
Operate at full speed making measurements with an Agilent
U4154A logic analyzer.
• Using U4154A with APS (Advanced Probe Settings*)
enabled, transfer rates up to 2400 Mb/s
• Using 16962A with APS enabled, transfer rates up to
1600Mb/s
• 4 GHz bandwidth (typical)
Works with existing designs. Eliminates need for re-design or up front planning.
Supports either leaded or lead-free solder. Easily works with all solder finishes. Designed to tolerate lead-
free soldering temperature profiles.
Contract manufactures available for those without
the in-house expertise or facilities for soldering BGAs.
Eliminates the need to develop BGA soldering expertise.
Flexible “wings” with ZIF connectors. Ensures reliable connection to the ZIF probes. Enables
placement of the probe cables around adjacent components.
Minimizes the torque to the balls of the BGA.
Attach to E5845A and E5847A single-ended ZIF probes for
connection to the logic analyzer.
Optimizes the use of logic analyzer channels by allowing
assignment of channels to 4, 8 or 16 bits on each DRAM.
Probe points available for soldering ZIF tip accessories to the
scope probe adapter board that connects to the BGA probe.
Enables oscilloscope probing of the DRAM signals with an
Agilent Infiniium 90000-Series oscilloscope, giving you a DDR3
test solution covering the clock characterization, electrical and
timing parameters of the JEDEC specification.
* To enable Advanced Probe Settings refer to Tech brief # 5991-0799EN. Maximum transfer rates are subject to variables in the signal
integrity of the system under test.
DDR3 BGA Probe Connection to an Agilent Logic Analyzer
The W3631A DDR3 BGA probe
connects to E5845A to provide
connection to the logic analyzer for
the x16 probe system. The W3633A
DDR3 BGA probe connects to E5847A
to provide connection to the logic
analyzer for the x4/x8 probe system.
Figure 1. E5847A 46-ch single-ended ZIF probe for x8 DRAM BGA probe connects to
90-pin logic analyzer cables
(21 Seiten)
Manymanuals.com
Manymanuals.de
Manymanuals.fr
Manymanuals.it
Manymanuals.pl
Manymanuals.cz
Manymanuals.es
Manymanuals-pt.com
Kommentare zu diesen Handbüchern